并联负载 8 位移位寄存器

TI

德州仪器

Package：16-SOIC（0.209"，5.30mm 宽）；包装：管件 功能：并行或串行至串行 类别：集成电路（IC） 移位寄存器 描述：LOGIC GATES AND INVERTERS

TI

德州仪器

Package：16-TSSOP（0.173"，4.40mm 宽）；包装：卷带（TR） 功能：并行或串行至串行 类别：集成电路（IC） 移位寄存器 描述：LOGIC GATES AND INVERTERS

TI

德州仪器

SN74HC165B-EP Enhanced Product, 5-V, Parallel-Load 8-Bit Shift Registers

1 Features • 2 V to 6 V VCC operation • Latch-up performance exceeds 250 mA per JESD 17 • Operating ambient temperature: -55°C to +125°C • Supports defense, aerospace, and medical applications: – Controlled baseline – One assembly and test site – One fabrication site – Extended product l

文件：844.1 Kbytes 页数：23 Pages

TI

德州仪器

SN74HC165B-EP Enhanced Product, 5-V, Parallel-Load 8-Bit Shift Registers

1 Features • 2 V to 6 V VCC operation • Latch-up performance exceeds 250 mA per JESD 17 • Operating ambient temperature: -55°C to +125°C • Supports defense, aerospace, and medical applications: – Controlled baseline – One assembly and test site – One fabrication site – Extended product l

文件：847.93 Kbytes 页数：24 Pages

TI

德州仪器

SN74HC165B-EP Enhanced Product, 5-V, Parallel-Load 8-Bit Shift Registers

1 Features • 2 V to 6 V VCC operation • Latch-up performance exceeds 250 mA per JESD 17 • Operating ambient temperature: -55°C to +125°C • Supports defense, aerospace, and medical applications: – Controlled baseline – One assembly and test site – One fabrication site – Extended product l

文件：812.26 Kbytes 页数：23 Pages

TI

德州仪器