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SN74GTLPH1655集成电路(IC)的通用总线功能规格书PDF中文资料

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厂商型号

SN74GTLPH1655

参数属性

SN74GTLPH1655 封装/外壳为64-TFSOP(0.240",6.10mm 宽);包装为管件;类别为集成电路(IC)的通用总线功能;产品描述:IC UNIV BUS TXRX 16BIT 64TSSOP

功能描述

16-BIT LVTTL-TO-GTLP ADJUSTABLE-EDGE-RATE UNIVERSAL BUS TRANSCEIVER
IC UNIV BUS TXRX 16BIT 64TSSOP

封装外壳

64-TFSOP(0.240",6.10mm 宽)

文件大小

266.36 Kbytes

页面数量

18

生产厂商

TI

中文名称

德州仪器

网址

网址

数据手册

原厂下载下载地址一下载地址二到原厂下载

更新时间

2025-11-16 16:50:00

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SN74GTLPH1655规格书详情

SN74GTLPH1655属于集成电路(IC)的通用总线功能。由德州仪器制造生产的SN74GTLPH1655通用总线功能通用总线功能系列产品是元件级产品,用于处理或操作一系列(通常为 8 个或更多)并行逻辑信号(称为总线)。所执行的功能包括临时存储要发送或接收的数据,执行缓冲以允许输出电流容量有限的器件(例如微处理器)通过远距离互连高速传输数据,以及调换或移动总线内的位顺序等。

FEATURES

· Member of Texas Instruments' Widebus™

Family

· UBT™ Transceiver Combines D-Type Latches

and D-Type Flip-Flops for Operation in

Transparent, Latched, or Clocked Modes

· TI-OPC™ Circuitry Limits Ringing on

Unevenly Loaded Backplanes

· OEC™ Circuitry Improves Signal Integrity and

Reduces Electromagnetic Interference

· Bidirectional Interface Between GTLP Signal

Levels and LVTTL Logic Levels

· Partitioned as Two 8-Bit Transceivers With

Individual Latch Timing and Output Control,

but With a Common Clock

· LVTTL Interfaces Are 5-V Tolerant

· High-Drive GTLP Outputs (100 mA)

· LVTTL Outputs (–24 mA/24 mA)

· Variable Edge-Rate Control (ERC) Input

Selects GTLP Rise and Fall Times for Optimal

Data-Transfer Rate and Signal Integrity in

Distributed Loads

· Ioff, Power-Up 3-State, and BIAS VCC Support

Live Insertion

· Bus Hold on A-Port Data Inputs

· Distributed VCC and GND Pins Minimize

High-Speed Switching Noise

· Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

· ESD Protection Exceeds JESD 22

– 2000-V Human-Body Model (A114-A)

– 200-V Machine Model (A115-A)

– 1000-V Charged-Device Model (C101)

DESCRIPTION

The SN74GTLPH1655 is a high-drive, 16-bit UBT™ transceiver that provides LVTTL-to-GTLP and

GTLP-to-LVTTL signal-level translation. It is partitioned as two 8-bit transceivers and allows for transparent,

latched, and clocked modes of data transfer. The device provides a high-speed interface between cards

operating at LVTTL logic levels and a backplane operating at GTLP signal levels. High-speed (about three times

faster than standard LVTTL or TTL) backplane operation is a direct result of GTLP's reduced output swing

(<1 V), reduced input threshold levels, improved differential input, OEC™ circuitry, and TI-OPC™ circuitry.

Improved GTLP OEC and TI-OPC circuits minimize bus-settling time and have been designed and tested using

several backplane models. The high drive allows incident-wave switching in heavily loaded backplanes with

equivalent load impedance down to 11 W.

GTLP is the Texas Instruments (TI™) derivative of the Gunning Transceiver Logic (GTL) JEDEC standard

JESD 8-3. The ac specification of the SN74GTLPH1655 is given only at the preferred higher noise-margin GTLP,

but the user has the flexibility of using this device at either GTL

VTT = 1.2 V and VREF = 0.8 V) or GTLP (VTT = 1.5 V and VREF = 1 V) signal levels.

Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels,

but are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs. VREF is the B-port differential input

reference voltage.

This device is fully specified for live-insertion applications using Ioff, power-up 3-state, and BIAS VCC. The Ioff

circuitry disables the outputs, preventing damaging current backflow through the device when it is powered

down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power

down, which prevents driver conflict. The BIAS VCC circuitry precharges and preconditions the B-port input/output

connections, preventing disturbance of active data on the backplane during card insertion or removal, and

permits true live-insertion capability.

This GTLP device features TI-OPC circuitry, which actively limits overshoot caused by improperly terminated

backplanes, unevenly distributed cards, or empty slots during low-to-high signal transitions. This improves signal

integrity, which allows adequate noise margin to be maintained at higher frequencies.

High-drive GTLP backplane interface devices feature adjustable edge-rate control (ERC). Changing the ERC

input voltage between GND and VCC adjusts the B-port output rise and fall times. This allows the designer to

optimize system data-transfer rate and signal integrity to the backplane load.

Active bus-hold circuitry holds unused or undriven LVTTL data inputs at a valid logic state. Use of pullup or

pulldown resistors with the bus-hold circuitry is not recommended.

When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down.

However, to ensure the high-impedance state above 1.5 V, the output-enable (OE) input should be tied to VCC

through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the

driver.

产品属性

更多
  • 产品编号:

    SN74GTLPH1655DGGR

  • 制造商:

    Texas Instruments

  • 类别:

    集成电路(IC) > 通用总线功能

  • 系列:

    74GTLPH

  • 包装:

    管件

  • 逻辑类型:

    通用总线收发器

  • 电路数:

    16 位

  • 电流 - 输出高、低:

    24mA,24mA

  • 电压 - 供电:

    3.15V ~ 3.45V

  • 工作温度:

    -40°C ~ 85°C

  • 安装类型:

    表面贴装型

  • 封装/外壳:

    64-TFSOP(0.240",6.10mm 宽)

  • 供应商器件封装:

    64-TSSOP

  • 描述:

    IC UNIV BUS TXRX 16BIT 64TSSOP

供应商 型号 品牌 批号 封装 库存 备注 价格
TI
25+23+
TSSOP64
43261
绝对原装正品现货,全新深圳原装进口现货
询价
TI
25+
TSSOP64
4500
全新原装、诚信经营、公司现货销售!
询价
TI
2016+
TSSOP64
6000
只做原装,假一罚十,公司可开17%增值税发票!
询价
24+
3000
自己现货
询价
TI
23+
TSSOP64
3200
正规渠道,只有原装!
询价
TI/德州仪器
24+
TSSOP-64
9600
原装现货,优势供应,支持实单!
询价
TI/德州仪器
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
询价
TI
23+
TSSOP64
5000
全新原装,支持实单,非诚勿扰
询价
TI
23+
TSSOP64
3200
公司只做原装,可来电咨询
询价
ADI
23+
TSSOP64
7000
询价