SN74AUP3G06YFPR集成电路（IC）的门反相器规格书PDF中文资料

SN74AUP3G06YFPR属于集成电路（IC）的门反相器。由德州仪器制造生产的SN74AUP3G06YFPR门和反相器逻辑栅极和逆变器系列中的产品对单个逻辑信号执行基本逻辑运算（例如 AND、NOT、OR 等）。与触发器不同，它们不能够存储信息，不会对提供给其输入的信号立即做出响应。虽然早就被集成电路实施形式所取代，以用于实现复杂功能，但分立栅极仍可在仅需要非常简单逻辑功能的情况下使用。

1FEATURES

• Available in the Texas Instruments NanoStar™

Package

• Low Static-Power Consumption

(ICC = 0.9 mA Maximum)

• Low Dynamic-Power Consumption

(Cpd = 4.3 pF Typ at 3.3 V)

• Low Input Capacitance (Ci = 1.5 pF Typical)

• Low Noise – Overshoot and Undershoot

<10% of VCC

• Ioff Supports Partial-Power-Down Mode

Operation

• Wide Operating VCC Range of 0.8 V to 3.6 V

• Optimized for 3.3-V Operation

• 3.6-V I/O Tolerant to Support Mixed-Mode

Signal Operation

• tpd = 4.3 ns Maximum at 3.3 V

• Suitable for Point-to-Point Applications

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• ESD Performance Tested Per JESD 22

– 2000-V Human-Body Model

(A114-B, Class II)

– 1000-V Charged-Device Model (C101)

DESCRIPTION/ORDERING INFORMATION

The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable

applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range

of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal

integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).

The output of SN74AUP3G06 is open drain and can be connected to other open-drain outputs to implement

active-low wired-OR or active-high wired-AND functions.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,

preventing damaging current backflow through the device when it is powered down.