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SN74AUC1G126DCKR.B中文资料德州仪器数据手册PDF规格书

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厂商型号

SN74AUC1G126DCKR.B

功能描述

SN74AUC1G126 Single Bus Buffer Gate With Tri-state Output

丝印标识

UNR

封装外壳

SC70

文件大小

810.93 Kbytes

页面数量

31

生产厂商

TI

中文名称

德州仪器

网址

网址

数据手册

下载地址一下载地址二到原厂下载

更新时间

2025-10-30 20:00:00

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SN74AUC1G126DCKR.B规格书详情

1 Features

1• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• ESD Protection Exceeds JESD22

– 2000-V Human-Body Model (A114-A)

– 200-V Machine Model (A115-A)

– 1000-V Charged-Device Model (C101)

• Available in TI's NanoFree™ Package

• Optimized for 1.8-V Operation and is 3.6-V I/O

Tolerant to Support Mixed-Mode Signal Operation

• Ioff Supports Partial Power Down Mode and Back

Drive Protection

• Sub-1 V Operable

• Maximum tpd of 2.5 ns at 1.8 V

• Low Power Consumption, 10-μA Maximum ICC

• ±8-mA Output Drive at 1.8 V

2 Applications

• AV Receiver

• Audio Dock: Portable

• Blu-ray™ Player and Home Theater

• Embedded PC

• MP3 Player/Recorder (Portable Audio)

• Personal Digital Assistant (PDA)

• Power: AC/DC Supply, Single Controller

• Solid State Drive (SSD): Client and Enterprise

• TV: LCD, Digital, and High-Definition (HD)

• Tablet: Enterprise

• Video Analytics: Server

• Wireless Headset, Keyboard, and Mouse

3 Description

The SN74AUC1G126 bus buffer gate is operational

at 0.8-V to 2.7-V VCC, but is designed specifically for

1.65-V to 1.95-V VCC operation.

The SN74AUC1G126 device is a single line driver

with a tri-state output. The output is disabled when

the output-enable (OE) input is low.

To ensure the high-impedance state during power up

or power down, OE should be tied to GND through a

pulldown resistor; the minimum value of the resistor is

determined by the current-sourcing capability of the

driver.

NanoFree™ package technology is a major

breakthrough in device packaging concepts, using the

die as the package.

This device is fully specified for partial-power-down

applications using Ioff. The Ioff circuitry disables the

outputs, which prevents damaging current backflow

through the device when it is powered down.

供应商 型号 品牌 批号 封装 库存 备注 价格
TI/德州仪器
24+
NA/
6250
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2022+
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1000
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TI/德州仪器
25+
DSBGA5
860000
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TI/德州仪器
24+
DSBGA
3000
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Texas Instruments
25+
5-XFBGA DSBGA
9350
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TI
715
275
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TI/德州仪器
23+
DSBGA
3000
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TI
23+
DSBGA
52271
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TI/德州仪器
2223+
DSBGA
26800
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