丝印：ALVCH16825；Package：TSSOP；18-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS

FEATURES · Member of the Texas Instruments Widebus™ Family · EPIC™ (Enhanced-Performance Implanted CMOS) Submicron Process · ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) · Latch-Up Performance Exceeds 250 mA Per JESD 17

文件：580.4 Kbytes 页数：17 Pages

TI

德州仪器

Member of the Texas Instruments Widebus

文件：343.71 Kbytes 页数：14 Pages

TI

德州仪器

丝印：ALVCH16825；Package：TSSOP；18-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS

FEATURES · Member of the Texas Instruments Widebus™ Family · EPIC™ (Enhanced-Performance Implanted CMOS) Submicron Process · ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) · Latch-Up Performance Exceeds 250 mA Per JESD 17

文件：580.4 Kbytes 页数：17 Pages

TI

德州仪器

Package：56-TFSOP（0.240"，6.10mm 宽）；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：集成电路（IC） 缓冲器，驱动器，接收器，收发器 描述：IC BUF NON-INVERT 3.6V 56TSSOP

TI

德州仪器