OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS

文件：1.28524 Mbytes 页数：20 Pages

TI

德州仪器

丝印：SN74ALS640B-1N；Package：PDIP；OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS

Bidirectional Bus Transceivers in High-Density 20-Pin Packages Inverting Logic Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs description These octal bus transceivers are designed for asynchr

文件：764.23 Kbytes 页数：18 Pages

TI

德州仪器

丝印：SN74ALS640B-1N；Package：PDIP；OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS

Bidirectional Bus Transceivers in High-Density 20-Pin Packages Inverting Logic Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs description These octal bus transceivers are designed for asynchr

文件：764.23 Kbytes 页数：18 Pages

TI

德州仪器

三态八路总线收发器

These octal bus transceivers are designed for asynchronous two-way communication between data buses. These devices transmit data from the A bus to the B bus or from the B bus to the A bus, depending upon the level at the direction-control (DIR) input. The output-enable () input can be used to disabl • Bidirectional Bus Transceivers in High-Density 20-Pin Packages \n• Inverting Logic \n• Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs;

TI

德州仪器

丝印：ALS640B-1；Package：SOIC；OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS

Bidirectional Bus Transceivers in High-Density 20-Pin Packages Inverting Logic Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs description These octal bus transceivers are designed for asynchr

文件：764.23 Kbytes 页数：18 Pages

TI

德州仪器

丝印：ALS640B-1；Package：SOIC；OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS

Bidirectional Bus Transceivers in High-Density 20-Pin Packages Inverting Logic Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs description These octal bus transceivers are designed for asynchr

文件：764.23 Kbytes 页数：18 Pages

TI

德州仪器

丝印：ALS640B-1；Package：SOIC；OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS

Bidirectional Bus Transceivers in High-Density 20-Pin Packages Inverting Logic Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs description These octal bus transceivers are designed for asynchr

文件：764.23 Kbytes 页数：18 Pages

TI

德州仪器

丝印：ALS640B-1；Package：SOP；OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS

Bidirectional Bus Transceivers in High-Density 20-Pin Packages Inverting Logic Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs description These octal bus transceivers are designed for asynchr

文件：764.23 Kbytes 页数：18 Pages

TI

德州仪器

丝印：ALS640B-1；Package：SOP；OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS

Bidirectional Bus Transceivers in High-Density 20-Pin Packages Inverting Logic Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs description These octal bus transceivers are designed for asynchr

文件：764.23 Kbytes 页数：18 Pages

TI

德州仪器

OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS

文件：1.28524 Mbytes 页数：20 Pages

TI

德州仪器