SMFJ6.5CA中文资料森美特数据手册PDF规格书
SMFJ6.5CA规格书详情
For surface mounted applications
Low profile package
clamping capability
cycle):0.01
High temperature soldering guaranteed:
260 ℃/10 seconds, at terminals
200W peak pulse power capability wi t h a 10/1000 μ
Features
Low incremental surge resistance, excellent
s
wave from,repetition rate (duty
