SMF19A中文资料友台半导体数据手册PDF规格书

FEATURES

For surface mounted applications

Low-profile package

Optimized for LAN protection applications

Ideal for ESD protection of data lines in

accordance with IEC 61000-4-2 (IEC 801-2)

Ideal for EFT protection of data lines in

accordance with IEC 61000-4-4 (IEC 801-4)

ESD-protection acc. IEC 61000-4-2

± 30 kV contact discharge

± 30 kV air discharge

Low incremental surge resistance, excellent clamping

capability

200 W peak pulse power capability with a 10/1000 μs

waveform, repetition rate (duty cycle): 0.01

“Low-Noise” technology - very fast response time

High temperature soldering guaranteed: 260 °C/10 s at

terminals

e 3 -

S n

AEC-Q101 qualified