SMF190ASMF5.0CA中文资料优恩半导体数据手册PDF规格书

Features

A

Compatible with industrial standard package SOD-123

For surface mounted applications in order to optimize board space

Low leakage

Uni and Bidirectional unit

Glass passivated junction

Low inductance

Excellent clamping capability

200W Peak power capability at 10 × 1000μs waveform Repetition

rate (duty cycle):0.01%

Fast response time: typically less than 1.0ps from 0 Volts to VBR min

Typical IR less than 1μA above 12V

High Temperature soldering: 260°C/40 seconds at terminals

Typical maximum temperature coefficient ΔVBR = 0.1% ×VBR@25°C× ΔT

Plastic package has Underwriters Laboratory Flammability 94V-0

Matte tin lead–free Plated

Halogen free and RoHS compliant

Typical failure mode is short from over-specified voltage or current

Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c

IEC-61000-4-2 ESD 15kV(Air), 8kV (Contact)

ESD protection of data lines in accordance with IEC 61000-4-2 (IEC801-2)

EFT protection of data lines in accordance with IEC 61000-4-4 (IEC801-4)