SMBJ6.8CA中文资料友台半导体数据手册PDF规格书

FEATURES

Low profile package

Ideal for automated placement

Glass passivated chip junction

Available in uni-directional and bi-directional

600 W peak pulse power capability with a

10/1000 μs waveform, repetitive rate (duty

cycle): 0.01

Excellent clamping capability

Very fast response time

Low incremental surge resistance

Meets MSL level 1, per J-STD-020, LF maximum peak

of 260 °C

AEC-Q101 qualified available

- Automotive ordering code: base P/NHE3 or P/NHM3