CERAMIC MELF PIN DIODES

DESCRIPTION This new line of ‘MELF’ high power PIN diodes are hermetically sealed surface mount packaged devices with full face bonded chips for low inductance construction. The MELF ceramic package has square end terminations which are ideal for surface mount and pick and place operations. The P

文件：177.81 Kbytes 页数：2 Pages

MICROSEMI

美高森美

Surface Mount PIN Diodes

This line of \"MELF\" high power PIN diodes are hermetically sealed surface mount packaged devices with full face bonded chips for low inductance construction. The MELF ceramic package has square end terminations which are ideal for surface mount and pick and place operations. The PIN diode chips ar

Microchip

微芯科技

Package：1208（3020 公制）；包装：卷带（TR） 类别：分立半导体产品 二极管 - 射频 描述：SI PIN HERMETIC MELF

MICROCHIP

微芯科技

Package：1208（3020 公制）；包装：卷带（TR） 类别：分立半导体产品 二极管 - 射频 描述：SI PIN HERMETIC MELF

MICROCHIP

微芯科技