UG310: XBee3??Expansion Kit

文件：3.509 Mbytes 页数：16 Pages

SILABS

芯科科技

包装：盒 类别：开发板，套件，编程器 射频评估和开发套件，开发板 描述：XBEE3 LTE-M MOD EXPANSION KIT

SILICONLABS

芯科

Built in active discharge circuit for fast turn-off

文件：240.74 Kbytes 页数：7 Pages

SSOUSA

Compact 8 pin DIP/SMD package

Features  Compact 8 pin DIP/SMD package  Built in active discharge circuit for fast turn-off  Fast Turn-On  Optional Parallel or Serial Output Connections  6V Gate Drive Voltage  High Input-to-Output Isolation (up to 5kVRMS)  Long Life / High Reliability  RoHS / Pb-Free / REACH Com

文件：252.11 Kbytes 页数：7 Pages

SOLIDSTATE

Stereo Headphone Power Amplifier

文件：404.21 Kbytes 页数：8 Pages

SSC

Silicon Standard Corp.