光电器件

SLKOR

萨科微

DEVICE SPECIFICATION FOR PHOTOCOUPLER

PC900V0NSZX Series ■ Description PC900V0NSZX Series contains an IRED optically coupled to an OPIC chip. It is packaged in a 6 pin DIP, available in SMT gullwing lead-form and Wide SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5.0kV. ■ Features 1. 6 pin DIP package

文件：658.11 Kbytes 页数：14 Pages

SHARPSharp Corporation

夏普

Mini-falt Package, General Purpose Half Pitch Photocoupler

■ Features 1. Mini-flat package 2. Half pitch type (lead pitch : 1.27mm) 3. Isolation voltage (Viso : 2 500Vrms) 4. Applicable to infrared ray reflow (230˚C, for MAX. 30s) 5. High reliability 6. Taping package PC3H7 (1ch) PC3Q67Q (4ch) 7. Recognized by UL, file No. E64380 Approved by VD

文件：67.15 Kbytes 页数：5 Pages

SHARPSharp Corporation

夏普

DEVICE SPECIFICATION FOR PHOTOCOUPLER

PC900V0NSZX Series ■ Description PC900V0NSZX Series contains an IRED optically coupled to an OPIC chip. It is packaged in a 6 pin DIP, available in SMT gullwing lead-form and Wide SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5.0kV. ■ Features 1. 6 pin DIP package

文件：658.11 Kbytes 页数：14 Pages

SHARPSharp Corporation

夏普