I.CODE1 Label IC Chip Specification

Scope This specification describes the electrical, physical and dimensional properties of unsawn and sawn wafers on FFC of I•CODE1 Label ICs on a Philips 6C15 IDFW process and is the base for delivery of tested I•CODE1 Label ICs. General recommendations are given for storage, handling and proces

文件：376.16 Kbytes 页数：22 Pages

PHI

PHI

I.CODE1 Label IC Chip Specification

Scope This specification describes the electrical, physical and dimensional properties of unsawn and sawn wafers on FFC of I•CODE1 Label ICs on a Philips 6C15 IDFW process and is the base for delivery of tested I•CODE1 Label ICs. General recommendations are given for storage, handling and proces

文件：376.16 Kbytes 页数：22 Pages

PHI

PHI

I.CODE1 Label IC Chip Specification

Scope This specification describes the electrical, physical and dimensional properties of unsawn and sawn wafers on FFC of I•CODE1 Label ICs on a Philips 6C15 IDFW process and is the base for delivery of tested I•CODE1 Label ICs. General recommendations are given for storage, handling and proces

文件：376.16 Kbytes 页数：22 Pages

PHI

PHI

I.CODE1 Label IC Chip Specification

Scope This specification describes the electrical, physical and dimensional properties of unsawn and sawn wafers on FFC of I•CODE1 Label ICs on a Philips 6C15 IDFW process and is the base for delivery of tested I•CODE1 Label ICs. General recommendations are given for storage, handling and proces

文件：376.16 Kbytes 页数：22 Pages

PHI

PHI

I.CODE1 Label IC Chip Specification

Scope This specification describes the electrical, physical and dimensional properties of unsawn and sawn wafers on FFC of I•CODE1 Label ICs on a Philips 6C15 IDFW process and is the base for delivery of tested I•CODE1 Label ICs. General recommendations are given for storage, handling and proces

文件：376.16 Kbytes 页数：22 Pages

PHI

PHI

I.CODE1 Label IC Chip Specification

Scope This specification describes the electrical, physical and dimensional properties of unsawn and sawn wafers on FFC of I•CODE1 Label ICs on a Philips 6C15 IDFW process and is the base for delivery of tested I•CODE1 Label ICs. General recommendations are given for storage, handling and proces

文件：376.16 Kbytes 页数：22 Pages

PHI

PHI

I.CODE1 Label IC Chip Specification

Scope This specification describes the electrical, physical and dimensional properties of unsawn and sawn wafers on FFC of I•CODE1 Label ICs on a Philips 6C15 IDFW process and is the base for delivery of tested I•CODE1 Label ICs. General recommendations are given for storage, handling and proces

文件：376.16 Kbytes 页数：22 Pages

PHI

PHI

I.CODE1 Label IC Chip Specification

Scope This specification describes the electrical, physical and dimensional properties of unsawn and sawn wafers on FFC of I•CODE1 Label ICs on a Philips 6C15 IDFW process and is the base for delivery of tested I•CODE1 Label ICs. General recommendations are given for storage, handling and proces

文件：376.16 Kbytes 页数：22 Pages

PHI

PHI

I.CODE1 Label IC Chip Specification

Scope This specification describes the electrical, physical and dimensional properties of unsawn and sawn wafers on FFC of I•CODE1 Label ICs on a Philips 6C15 IDFW process and is the base for delivery of tested I•CODE1 Label ICs. General recommendations are given for storage, handling and proces

文件：376.16 Kbytes 页数：22 Pages

PHI

PHI

I.CODE1 Label IC Chip Specification

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