SKY77927-11数据手册Skyworks中文资料规格书

描述 Description

Please note: SKY77927-11 is being discontinued and is not recommended for new designs.

The SKY77927-11 SkyLiTE™ Tx/Rx Front-End Module (FEM) offers a complete Power Amplifier (PA) and switching solution for advanced 2G/3G/4G cellular handsets.

Two PAs support quad-band GSM, GPRS, EDGE multi-slot operation and TD-SCDMA and TDD LTE transmission. The low band (LB) PA transmits in the GSM850/900 bands. The mid-band (MB) PA covers DCS1800, PCS1900, TD-SCDMA bands 34/39, and TDD LTE band 39. The FEM facilitates flexible broadband RF switch-through by means of outward switching of the LB/MB PA RF inputs and 16 transmit/receive (TRx) antenna switch ports covering all 3G/4G bands from 700 MHz through 2300-2700 MHz. In support of downlink inter-band Carrier Aggregation (CA), the TRx ports are partitioned into two independent switch blocks, comprising 7 LB ports and 9 M/HB ports. Each switch block includes an integrated directional coupler that may be monitored on the CPL port with selectable forward or reverse directionality. A built-in diplexer provides simultaneous LB and M/HB reception required for downlink CA at the single antenna port.

The SKY77927-11 includes a full set of features for state-of-the-art performance and minimal phone board complexity. The Heterojunction Bipolar Transistor (HBT) PA blocks are fabricated in Gallium Arsenide (GaAs). The HBT, switches, controller die, and passive components are mounted on a multi-layer laminate substrate. A plastic over-mold encapsulates the entire assembly.

The CMOS controller provides PA band/mode selection and bias control including the Mobile Industry Processor Interface (MIPI®) RFFE logic and switch decoder circuitry. The PA controller provides VRAMP control of the GMSK envelope and reduces sensitivity to input drive, temperature, power supply, and process variations. Skyworks’ Finger-Based Integrated Power Amplifier Control (FB-iPAC) minimizes output power variation into mismatch. In EDGE and TD-SCDMA / TDD LTE linear modes, VRAMP voltage and MIPI-based bias settings jointly optimize PA linearity and efficiency.

特性 Features

• Small, low profile package: 5.5 mm x 5.5 mm x 0.8 mm Max, 44-pad configuration
• MIPI® RFFE control
• RF ports internally matched to 50 \u001E w/ zero DC offset
• High GMSK Efficiency (inclusive of coupler and diplexer)
• 34% GSM850 34% DCS1800
• 34% GSM900 34% PCS1900