SKY77629中文资料Multimode Multiband Power Amplifier Module for Quad-Band GSM/EDGE – Hexa-Band (I, II, III, IV, V, VIII) WCDMA / HSDPA / HSUPA / HSPA+ / LTE数据手册Skyworks规格书

描述 Description

Please note: SKY77629-13, SKY77629-21, SKY77629-21B, and SKY77629-51 are being discontinued and are not recommended for new designs.

The SKY77629 is a hybrid, multimode multiband (MMMB) Power Amplifier Module (PAM) that supports 2.5G and 3G/4G handsets and operates efficiently in GSM, EGPRS, EDGE, WCDMA, and LTE modes. The PAM consists of: a GSM 800 / EGSM 900 PA block, a DCS1800 / PCS1900 PA block, separate WCDMA blocks operating in low and high bands, a logic control block for multiple power control levels, and band enable functions in both cellular and UMTS. RF I/O ports are internally matched to 50 Ω to minimize the number of external components. Extremely low leakage current maximizes handset standby time. The InGaP/GaAs die and passive components are mounted on a multi-layer laminate substrate and the assembly encapsulated in plastic overmold.

GSM/EDGE: The SKY77629 uses a new compact architecture supporting the GSM850, EGSM900, DCS1800 and PCS1900 bands. The PAM also supports 2.5G Class 12 Enhanced General Packet Radio Service (EGPRS) multi-slot operation and EDGE linear modulation.

WCDMA: The SKY77629 uses an enhanced architecture to: support WCDMA, High-Speed Downlink Packet Access (HSDPA), High-Speed Uplink Packet Access (HSUPA), and LTE modulations; cover multiple bands for 3GPP, including bands I, II, IV, V, and VIII; operate at different power modes. The module is fully controllable via MIPI interface.

LTE: The SKY77629 meets spectral linearity requirements of LTE modulation with QPSK/16QAM up to 20 MHz bandwidth, including various resource block allocations, with good power-added efficiency.

特性 Features

• Hybrid architecture: separate GSM, WCDMA paths
• 50 ohm input and output impedances, integrated DC blocking on all ports
• Separate single-ended GSM and WCDMA inputs and outputs
• CMOS-compatible, two-wire MIPI logic inputs (SCLK, SDATA)
• VCC stages for 2.5G can attach to battery or buck DC/DC
• Low capacitance VCC interface for 3G/4G supports Envelope Tracking compatibility
• Small, low profile package: 7 mm x 5 mm x 0.9 mm, 42-pad configuration
• 2.5G FEATURES:
• EGPRS Class 12 multi-slot operation
• Four RF POUT control levels using RFFE interface
• Linear PA with bias optimization for efficiency/linearity trade-off in 8-PSK mode