SKY66430-11中文资料5G Massive IoT System-in-Package数据手册Skyworks规格书

描述 Description

The SKY66430-11 is a multi-band multi-chip System-in-Package (SiP) supporting 5G Massive IoT (LTE-M/NB-IoT)platforms. The SiP integrates the entire RF front end,transceiver, power management, memory, and basebandmodem for an LTE multi-band radio operating in the 698 to2200 MHz frequency range. NOR flash, crystals, and a fewpassives external to the package complete the SiPimplementation.

Evaluation/Development Kits

Skyworks/Sequans: The EVK (evaluation kit) provides cellular LTE-M/NB-IoT connectivity to the SKY66430-11 multi-band system-in-package (SiP) supporting 5G massive IoT. View Kit

Mikroe: LTE IoT 8 Click is a compact add-on board that contains a low-power solution for LTE and NB-IoT connectivity. This board features the SKY66430-11, a multi-band multi-chip System-in-Package (SiP) supporting 5G Massive IoT (LTE-M/NB-IoT) platforms from Skyworks Solutions and Sequans CommunicationsView Kit

特性 Features

• Complete BB to RF solution in a single package:
•
• Integrated baseband, transceiver, RF front end, RAM memory, and power management
• 8.8 x 10.8 x 0.95 mm BGA package, 0.5 mm pitch
• Device weight: 229 mg

应用 Application

• Cellular IoT and M2M
• Industrial IoT
• Factory Automation
• Smart Energy
• Wearables

简介

SKY66430-11属于RF/IF射频/中频RFID的射频收发器模块调制解调器。由Skyworks制造生产的SKY66430-11射频收发器模块和调制解调器RF 收发器模块用于发送和/或接收射频信号。射频系列/标准有蓝牙、蜂窝、通用 ISM、GPS、导航、SiBeam、WiFi 和 802.15.4，频率范围为 70 MHz 至 65 GHz。数据速率为 600 bps 到 12.3 Gbps，功率输出为 -10 dBm 到 54 dBm。