SKY66002-11-EVB开发板套件编程器的射频评估开发套件开发板规格书PDF中文资料

SKY66002-11-EVB属于开发板套件编程器的射频评估开发套件开发板。由美国思佳讯公司制造生产的SKY66002-11-EVB射频评估和开发套件，开发板本系列中的产品适用于在已知实施环境中，提供能访问射频相关器件的功能或者有助于访问该功能。所含的焦点产品范围从射频信号链元器件（如放大器和检测器）到模块化收发器，以及不直接包含焦点产品的适配器硬件，但此类硬件可供方便地访问用户单独提供的特定射频产品或系列。

Applications

• Residential femtocells

• WCDMA, Band 2

• Small cells

Features

• Small signal gain: 29 dB

• ACLR at POUT = +19 dBm: -50 dBc

• PA on/off control

• I/O impedance internally matched to 50 Ω

• Single DC supply: 3.3 V to 4.6 V

• Minimal number of external components required

• Small footprint MCM (10-pin, 3 x 3 mm) package

(MSL3, 260 °C per JEDEC J-STD-020)

Description

The SKY66002-11 linear power amplifier (PA) is a fully

matched surface-mount module developed for WCDMA

applications operating from 1900 to 2025 MHz. The device

meets the stringent spectral linearity requirements of

WCDMA femtocell applications with high power-added

efficiency. An integrated directional coupler eliminates the

need for any external coupler.

The GaAs MMIC contains all active amplifier circuitry, which

includes input and interstage matching circuits. An output

match into a 50 Ω load, realized off-chip within the module

package, optimizes efficiency and power performance.

The SKY66002-11 is manufactured with Skyworks InGaP

GaAs HBT process, which provides for all positive voltage

DC supply operation and maintains high efficiency and good

linearity. The primary bias to the device can be supplied

directly from any suitable power supply with an output of

4.2 V. Power down is achieved by setting the VEN pin to 0 V.

No external supply side switch is needed since typical “off”

leakage is a few microamps with full primary voltage

supplied from the main power supply.

The SKY66002-11 is packaged in a 10-pin, 3 x 3 mm Multi-

Chip Module (MCM), which allows for a highly

manufacturable low-cost solution.

A functional block diagram of the SKY66002-11 is shown in

Figure 1. The 10-pin MCM package and pinout are shown in

Figure 2. Signal pin assignments and functional pin

descriptions are provided in Table 1.