3~phase

文件：261.93 Kbytes 页数：3 Pages

Semikron

赛米控丹佛斯

Low thermal resistance

MECHANICAL DESCRIPTION The AAP Gen 7 (TO-240AA), new generation of APP module, combines the excellent thermal performances obtained by the usage of exposed direct bonded copper substrate, with advanced compact simple package solution and simplified internal structure with minimized number of inte

文件：310.3 Kbytes 页数：9 Pages

VishayVishay Siliconix

威世科技

Low thermal resistance

MECHANICAL DESCRIPTION The AAP Gen 7 (TO-240AA), new generation of APP module, combines the excellent thermal performances obtained by the usage of exposed direct bonded copper substrate, with advanced compact simple package solution and simplified internal structure with minimized number of inte

文件：310.3 Kbytes 页数：9 Pages

VishayVishay Siliconix

威世科技

Low thermal resistance

MECHANICAL DESCRIPTION The AAP Gen 7 (TO-240AA), new generation of APP module, combines the excellent thermal performances obtained by the usage of exposed direct bonded copper substrate, with advanced compact simple package solution and simplified internal structure with minimized number of inte

文件：310.3 Kbytes 页数：9 Pages

VishayVishay Siliconix

威世科技