CE conformity

FEATURES J J I4 « CE conformity * Built to meet European Standard BS EN 60335-2-45 ! * Full power range from 12 to 50 watt * Wide choice of input voltages * “Thermally balanced” fixed setting and “In Handle” adjustable temperature models * Wide range of soldering and desoldering-b

文件：598.09 Kbytes 页数：8 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

Carbon Film Resistors, Standard

文件：203.37 Kbytes 页数：4 Pages

VISHAYVishay Siliconix

威世威世科技公司

3-phase Converter-Inverter (CI)

Features* • Optimized design for superior thermal performance • Low inductive design • Press-Fit contact technology • 1200V Generation 7 IGBT (T7) • Robust and soft switching CAL4F diode technology • PEP rectifier diode technology for enhanced power and environmental robustness • Integr

文件：824.53 Kbytes 页数：8 Pages

SEMIKRON

赛米控丹佛斯

3-phase Converter-Inverter (CI)

Features* • Optimized design for superior thermal performance • Low inductive design • Solder contact technology • 1200V Generation 7 IGBT (T7) • Robust and soft switching CAL4F diode technology • PEP rectifier diode technology for enhanced power and environmental robustness • Integrate

文件：787.97 Kbytes 页数：8 Pages

SEMIKRON

赛米控丹佛斯

3-phase Converter-Inverter-Brake (CIB)

Features* • Optimized design for superior thermal performance • Low inductive design • Press-Fit contact technology • 1200V Generation 7 IGBT (T7) • Robust and soft switching CAL4F diode technology • PEP rectifier diode technology for enhanced power and environmental robustness • Integr

文件：1.00349 Mbytes 页数：10 Pages

SEMIKRON

赛米控丹佛斯

3-phase Converter-Inverter-Brake (CIB)

Features* • Optimized design for superior thermal performance • Low inductive design • Solder contact technology • 1200V Generation 7 IGBT (T7) • Robust and soft switching CAL4F diode technology • PEP rectifier diode technology for enhanced power and environmental robustness • Integrate

文件：968.15 Kbytes 页数：10 Pages

SEMIKRON

赛米控丹佛斯

IGBT module

Features* • Low inductive design • Press-Fit contact technology • Rugged mounting due to integrated mounting clamps • Heat transfer and insulation through direct copper bonded aluminium oxide ceramic (DBC) • Trench4 IGBT technology • Robust and soft switching CAL4F diode technology • In

文件：771.2 Kbytes 页数：8 Pages

SEMIKRON

赛米控丹佛斯

Sixpack Open Emitter

Features* • Optimized design for superior thermal performance • Low inductive design • Press-Fit contact technology • 1200V Generation 7 IGBT (T7) • Robust and soft switching CAL4F diode technology • Integrated NTC temperature sensor • UL recognized file no. E 63 532 Typical Applicatio

文件：832.87 Kbytes 页数：8 Pages

SEMIKRON

赛米控丹佛斯

Sixpack Open Emitter

Features* • Optimized design for superior thermal performance • Low inductive design • Press-Fit contact technology • 1200V Generation 7 IGBT (T7) • Robust and soft switching CAL4F diode technology • Integrated NTC temperature sensor • UL recognized file no. E 63 532 Typical Applicatio

文件：855.06 Kbytes 页数：8 Pages

SEMIKRON

赛米控丹佛斯

H-Bridge Open Source (Full SiC)

Features* • Optimized design for superior thermal performance • Low inductance design • Press-Fit contact technology • 1200V Trench Gen4 SiC MOSFET • Unipolar gate control • Integrated NTC temperature sensor • UL recognized file no. E 63 532 Typical Applications • Electric Vehicle char

文件：215.79 Kbytes 页数：6 Pages

SEMIKRON

赛米控丹佛斯