Antiparallel Thyristor Module

Features • Compact design • One screw mounting • Heat transfer and insulation through direct copper bonded aluminum oxide ceramic (DBC) • Glass passivated thyristor chips • Up to 1200V reverse voltage • UL recognized file no. E 63 532 Typical Applications* • Soft starters • Light cont

文件：443.6 Kbytes 页数：4 Pages

Semikron

赛米控丹佛斯

晶闸管/二极管模块

• Compact design\n• One screw mounting\n• Heat transfer and insulation through direct copper bonded aluminum oxide ceramic (DBC)\n• Glass passivated thyristor chips\n• Up to 1200V reverse voltage\n• UL recognized file no. E 63 532;

Semikron-DANFOSS

赛米控丹佛斯

Antiparallel Thyristor Module

文件：485.23 Kbytes 页数：3 Pages

Semikron

赛米控丹佛斯

TSC
DO214

TSC

台湾半导体

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TOSHIP
DO-214AB

TOSHIP

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