SK25GAD063T中文资料IGBT模块数据手册Semikron-DANFOSS规格书

特性 Features

·Compact design
·One screw mounting
·Heat transfer and isolation through direct copper bonded aluminium oxide ceramic (DCB)
·N channel, homogeneous Silicon structure (NPT-Non punchtrough IGBT)
·High short circuit capability
·Low tail current with low temperature dependence
·UL recognized, file no. E63532
·Integrated PTC temperature sensor

应用 Application

·Switching (not for linear use)
·Inverter
·Switched mode power supplies
·UPS