IGBT module

Features* • Compact design • One screw mounting module • Heat transfer and insulation through direct copper bonded aluminium oxide ceramic (DBC) • 600V Trench IGBT3 technology • 600V CAL IHD diode technology • Integrated NTC temperature sensor • UL recognized, file no. E 63 532 Typical

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SEMIKRON

赛米控丹佛斯

IGBT模块

• Compact design\n• One screw mounting module\n• Heat transfer and insulation through direct copper bonded aluminium oxide ceramic (DBC) \n• 600V Trench3 IGBT technology\n• CAL4 diode technology FWD \n• Integrated NTC temperature sensor\n• UL recognized, file no. E 63 532;

Semikron-DANFOSS

赛米控丹佛斯

SOT23 T/R

UTC

友顺

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SOT23

UTC(友顺)

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SMA(DO-214AC)

MCC

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