IGBT module

Features* • Compact design • One screw mounting module • Heat transfer and isolation through direct copper bonded aluminium oxide ceramic (DBC) • 650V Fast Trench3 IGBT technology • CAL diode technology • Integrated NTC temperature sensor • UL recognized, file no. E 63 532 Typical Appl

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Semikron

赛米控丹佛斯

IGBT模块

·Compact design\n·One screw mounting module\n·Heat transfer and isolation through direct copper bonded aluminium oxide ceramic (DBC)\n·650V Fast Trench3 IGBT technology\n·CAL diode technology \n·Integrated NTC temperature sensor\n·UL recognized, file no. E 63 532;

Semikron-DANFOSS

赛米控丹佛斯

SOT23 T/R

UTC

友顺

上传：深圳市华博特电子有限公司

SOT23

UTC(友顺)

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SMA(DO-214AC)

MCC

上传：北京京北通宇电子元件有限公司