3M??Bumpon??Protective Products Resilient Rollstock

文件：275.54 Kbytes 页数：8 Pages

3M

MIL-Grade System Development Kit COM Express R3.0 Basic Module Type 6 MXM Graphic and IP67 Waterproof

Features ƒ Robust System Followed Open Standard VITA 75.0 ƒ Modular Structure Comes with COMe, Carrier, I/O and Power Modules ƒ MIL-DTL-38999 Circular Connectors with IP Waterproof ƒ Design to Meet MIL-STD 810, 461 and IPC-A-610 Class 3 ƒ Operating Temperature up to -40 ~ 55°C ƒ Wide Range P

文件：417.39 Kbytes 页数：2 Pages

ADVANTECH

研华科技

Development Board for COM Express Type 6 Pin-out Modules

文件：1.20101 Mbytes 页数：2 Pages

ADVANTECH

研华科技

MIL-Grade System Development Kit COM Express R3.0 Basic Module Type 6 MXM Graphic and IP67 Waterproof

Features ƒ Robust System Followed Open Standard VITA 75.0 ƒ Modular Structure Comes with COMe, Carrier, I/O and Power Modules ƒ MIL-DTL-38999 Circular Connectors with IP Waterproof ƒ Design to Meet MIL-STD 810, 461 and IPC-A-610 Class 3 ƒ Operating Temperature up to -40 ~ 55°C ƒ Wide Range P

文件：417.39 Kbytes 页数：2 Pages

ADVANTECH

研华科技