SIHFBF20STR-E3中文资料威世科技数据手册PDF规格书

DESCRIPTION

Third generation Power MOSFETs form Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.

The D2PAK is a surface mount power package capabel of the accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2PAK is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0 W in a typical surface mount application. The through-hole version (IRFBF20L/SiHFBF20L) is available for low-profile applications.

FEATURES

• Surface Mount (IRFBF20S/SiHFBF20S)

• Low-Profile Through-Hole (IRFBF20L/SiHFBF20L)

• Available in Tape and Reel

   (IRFBF20S/SiHFBF20S)

• Dynamic dV/dt Rating

• 150 °C Operating Temperature

• Fast Switching

• Fully Avalanche Rated

• Lead (Pb)-free Available