SIHF9Z14S-E3中文资料威世科技数据手册PDF规格书

DESCRIPTION

Third generation Power MOSFETs from Vishay utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The D2PAK is a surface mount power package capable of accommodating die size up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2PAK is suitable for high current applications because of is low internal connection resistance and can dissipate up to 2.0 W in a typical surface mount application.

The through-hole version (IRF9Z14L/SiHF9Z14L) is available for low-profile applications.

FEATURES

• Advanced Process Technology

• Surface Mount (IRF9Z14S/SiHF9Z14S)

• Low-ProfileThrough-Hole (IRF9Z14L/SiHF9Z14L)

• 175 °C Operating Temperature

• Fast Switching

• P-Channel

• Fully Avalanche Rated

• Lead (Pb)-free Available