模拟输入智能音频功放芯片

SIA810X系列是聚芯研发的具有独立知识产权的模拟输入智能音频功放芯片。芯片集成了振幅保护、温度保护和升压模块，具有高性能、小尺寸、简单易用等特点。产品配合聚芯自研的Sound IntelligenceTM音质增强和喇叭保护算法，可提供业界一流的听音体验及品质保障。该算法方案具有低MIPS、易集成等特点，在高通和MTK平台均可提供一站式的软件系统集成方案。系统级双Layout设计及管脚定义，可兼容市场上主流模拟音频功放产品。本系列产品采用WLCSP(Wafer Level Chip Scale Packaging)晶圆级芯片封装方式，最大限度降低了芯片尺寸，并有效提升了数据传输的速度与稳定性 • 更高响度\n• 更加安全\n• 更好音质\n• 更高性价比\n• 更节能环保\n - 4.2V输入8Ω负载，效率高达79%;

Si-IN

聚芯微电子

Compact 1U High Performance Server based on Intel® Xeon® Processor Scalable Family

Features ƒ 1U 20 deep rackmount server ƒ Single Intel® Xeon® Platinum, Gold, Silver or Bronze Processor ƒ 6x DIMM sockets support up to 384 GB DDR4 2933MHz ECC RDIMM/LRDIMM ƒ Rich Add-In Card Support: Up to two FH/FL PCIe x8 Gen3 slots (optional: one FH/FL PCIe x16 Gen3 slot), one LP PCIe x8

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ADVANTECH

研华科技

Compact 1U High Performance Server based on 2nd Gen Intel® Xeon® Scalable Processor Family

Features ƒ 1U 29.5 deep rackmount server ƒ Dual Intel® Xeon® Platinum, Gold, Silver or Bronze Processor ƒ 24 x DIMM sockets support up to 1536 GB DDR4 1600/1866/2133/2400/ 2666 MHz SDRAM (ECC/RDIMM/LRDIMM) ƒ Rich Add-In Card Support: Up to four FH/¾L PCIe x16 Gen3 slots ƒ Up to 4 x 2.5 hot-s

文件：828.9 Kbytes 页数：2 Pages

ADVANTECH

研华科技

Compact 1U High Capacity Storage Server based on Intel® Xeon® Processor Scalable Family

Features ƒ 1U 27.5 deep rackmount server ƒ Single Intel® Xeon® Platinum, Gold, Silver or Bronze Processor ƒ 6x DIMM sockets support up to 384GB DDR4 2933MHz ECC RDIMM/ LRDIMM ƒ Rich Add-In Card Support: Up to two FH/FL PCIe x8 Gen3 slots (optional: one FH/FL PCIe x16 Gen3 slot), one or two L

文件：1.26544 Mbytes 页数：2 Pages

ADVANTECH

研华科技