SEG10FG分立半导体产品的二极管-整流器-单规格书PDF中文资料

FEATURES

• Glass passivated pellet chip junction

• Low profile package

• Ideal for automated placement

• Low forward voltage drop, low leakage current

• ESD capability

• Meets MSL level 1, per J-STD-020,

LF maximum peak of 260 °C

• Wave and reflow solderable

• AEC-Q101 qualified available

• Compatible to SOD-123W package case outline

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

TYPICAL APPLICATIONS

General purpose, power line polarity protection, in

commercial, industrial, and automotive applications.

MECHANICAL DATA

Case: SMF (DO-219AB)

Molding compound meets UL 94 V-0 flammability rating

Base P/N-M3 - for halogen-free, RoHS-compliant

Base P/NHM3 - for halogen-free, RoHS-compliant, and

AEC-Q101 qualified

Terminals: matte tin plated leads, solderable per

J-STD-002 and JESD 22-B102

M3 and HM3 suffix meets JESD 201 class 2 whisker test