SA2K中文资料威世数据手册PDF规格书

FEATURES

• Low profile package

• Ideal for automated placement

• Glass passivated pellet chip junction

• Low forward voltage drop

• Low leakage current

• High forward surge capability

• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C

• Material categorization: for definitions of compliance please see www.vishay.com/doc?99912

TYPICAL APPLICATIONS

    For use in general purpose rectification of power supplies, inverters, converters and freewheeling diodes for consumer and telecommunication.