SA19中文资料优恩半导体数据手册PDF规格书

特性 Features

Glass passivated chip junction in DO-15 Package

Low leakage

Uni and Bidirectional unit

Excellent clamping capability

500W Peak power capability at 10 × 1000μs waveform Repetition

rate (duty cycle):0.01

Fast response time: typically less than 1.0ps from 0 Volts to VBR min

Typical IR less than 5μA above 8V

High Temperature soldering: 260°C/40 seconds at terminals

Typical maximum temperature coefficient

ΔVBR = 0.1 × VBR@25°C× ΔT

Plastic package has Underwriters Laboratory Flammability 94V-0

Matte tin lead–free Plated

Halogen free and RoHS compliant

Typical failure mode is short from over-specified voltage or current

Whisker test is conducted based on JEDEC JESD201A per its table

4a and 4c

IEC-61000-4-2 ESD 15kV(Air), 8kV (Contact)

ESD protection of data lines in accordance with

IEC 61000-4-2 (IEC801-2)

EFT protection of data lines in accordance with

IEC 61000-4-4 (IEC801-4)