S3EB-3V中文资料松下数据手册PDF规格书

FEATURES

1. Compact with high sensitivity The high-efficiency polarized electromagnetic circuits of the 4-gap balanced armature and our exclusive spring alignment method achieves, with high-sensitivity in a small package, a relay that can be directly controlled by a driver chip.

2. Strong resistance to vibration and shock Use of 4G-BA technology realizes strong resistance to vibration and shock.

3. High reliability and long life Our application of 4G-BA technology, along with almost perfectly complete twin contact, ensures minimal contact bounce and high reliability.

4. Ability to provide wide-ranging control Use of 4G-BA technology with goldclad silver alloy contacts in a twin contact structure enables control across a broad range from microcurrents of 100 μA 100 mV DC to 4 A 250 V AC.

5. Latching types available With 4G-BA technology, as well as single side stable types, convenient 2 coil latching types for circuit memory applications are also available.

6. Wide variety of contact formations available The compact size of the 4G-BA mechanism enables the provision of many kinds of package, including 2a2b, 3a1b, and 4a. These meet your needs across a broad range of applications.

7. Low thermal electromotive force High sensitivity (low power consumption) is realized by 4G-BA technology. Separation of the coil and spring sections has resulted in a relay with extremely low levels of thermal electromotive force (approx. 3 μV).

8. DIL terminal array Deployed to fit a 2.54 mm .100 inch grid, the terminals are presented in DIL arrays which match the printed circuit board terminal patterns commonly in international use.

9. Relays that push the boundaries of relay efficiency High-density S relays take you close to the limits of relay efficiency.

10. Sockets are available.

TYPICAL APPLICATIONS

Telecommunications equipment, data processing equipment, facsimiles, alarm equipment, measuring equipment.