S25FL256SDPNFB0集成电路（IC）的存储器规格书PDF中文资料

S25FL256SDPNFB0属于集成电路（IC）的存储器。由赛普拉斯半导体公司制造生产的S25FL256SDPNFB0存储器存储器是集成电路上用作数据存储设备的半导体器件。这些器件分为非易失性或易失性两种，格式包括 CBRAM、DRAM、EEPROM、EERAM、EPROM、闪存、FRAM、NVSRAM、PCM (PRAM)、PSRAM、RAM 和 SRAM。这些器件的存储容量为 64 b 至 6 Tb 不等，接口有 I2C、MMC、并行、eMMC、串行、单线、SPI、UFS、Xccela 总线和 1-线。

特性 Features

 CMOS 3.0 Volt Core with Versatile I/O

 Serial Peripheral Interface (SPI) with Multi-I/O

– SPI Clock polarity and phase modes 0 and 3

– Double Data Rate (DDR) option

– Extended Addressing: 24- or 32-bit address options

– Serial Command set and footprint compatible with S25FL-A, S25FL-K, and S25FL-P SPI families

– Multi I/O Command set and footprint compatible with S25FL-P SPI family

 READ Commands

– Normal, Fast, Dual, Quad, Fast DDR, Dual DDR, Quad DDR

– AutoBoot - power up or reset and execute a Normal or Quad read command automatically at a preselected address

– Common Flash Interface (CFI) data for configuration information.

 Programming (1.5 Mbytes/s)

– 256 or 512 Byte Page Programming buffer options

– Quad-Input Page Programming (QPP) for slow clock systems

– Automatic ECC -internal hardware Error Correction Code generation with single bit error correction

 Erase (0.5 to 0.65 Mbytes/s)

– Hybrid sector size option - physical set of thirty two 4-kbyte sectors at top or bottom of address space with all remaining sectors of 64 kbytes, for compatibility with prior generation S25FL devices

– Uniform sector option - always erase 256-kbyte blocks for software compatibility with higher density and future devices.

 Cycling Endurance

– 100,000 Program-Erase Cycles, minimum

 Data Retention

– 20 Year Data Retention, minimum

 Security features

– One Time Program (OTP) array of 1024 bytes

– Block Protection:

– Status Register bits to control protection against program or erase of a contiguous range of sectors.

– Hardware and software control options

– Advanced Sector Protection (ASP)

– Individual sector protection controlled by boot code or password

 Cypress® 65 nm MirrorBit® Technology with Eclipse™ Architecture

 Core Supply Voltage: 2.7V to 3.6V

 I/O Supply Voltage: 1.65V to 3.6V

– SO16 and FBGA packages

 Temperature Range / Grade:

– Industrial (-40°C to +85°C)

– Industrial Plus (-40°C to +105°C)

– Automotive AEC-Q100 Grade 3 (-40°C to +85°C)

– Automotive AEC-Q100 Grade 2 (-40°C to +105°C)

– Automotive AEC-Q100 Grade 1 (-40°C to +125°C)

 Packages (all Pb-free)

– 16-lead SOIC (300 mil)

–WSON 6 x 8 mm

– BGA-24 6 x 8 mm

– 5 x 5 ball (FAB024) and 4 x 6 ball (FAC024) footprint options