Embedded Arrays

• High-density integration (0.18 µm CMOS process technology using 3/4/5/6-layer interconnect process, number of raw gates: 5,300,000 Max.)\r\n• High-speed operation (Internal gate delay: 43.6ps/1.8V, 2-input NAND Typ.)\r\n• Selectable supply voltage: Operation on single power supply (1.8V, 1.5V),\r\;

Epson

爱普生

STANDARD CELL / EMBEDDED ARRAY

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EPSON

爱普生

Shindengen
SOP-4

SHINDENGEN

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