Bluetooth

Low Power Bluetooth Audio SoC, designed for use in mainstream Bluetooth speakers, stereo headsets and truly wireless earbuds.\n\nQC5125 is a part of the QCC5100 Low Power Bluetooth Audio SoC Series. • Bluetooth\n• Voice Services\n• General Audio\n• CPU\n• DSP\n• Power Consumption\n• Package\n - Package Type: BGA\n - Pins: 90 pins\n - Pitch: 0.5mm Pitch\n - Package Size: 5.5 x 5.5 x 1 mm\nLicense Keys: Qualcomm® cVc™ noise suppression technology, Qualcomm® aptX™ audio technology, Qualcomm® A;

Qualcomm

高通

Low power SoC designed for mainstream Bluetooth speakers, stereo headsets and earbuds.

Low Power Bluetooth Audio SoC, designed for use in mainstream Bluetooth speakers, stereo headsets and truly wireless earbuds.\n\nQC5125 is a part of the QCC5100 Low Power Bluetooth Audio SoC Series. • Low power design\n• Bluetooth 5.1 radio\n• 2Mbps Bluetooth low energy (LE) support\n• Ultra-small form factor\n• Powerful quad-core processor* architecture\n• Dual core 32-bit processor application subsystem\n• Single core Qualcomm® Kalimba™ DSP Audio subsystem\n• Embedded ROM + RAM and external Q;

Qualcomm

高通

3V TO 5V, 2.4GHz TO 2.5GHz LINEAR POWER AMPLIFIER

Product Description The RF5125 is a linear, medium-power, high-efficiency, two-stage amplifier IC designed specifically for battery-powered WLAN applications such as PC cards, mini PCI, and compact flash applications. The device is manufactured on an advanced InGaP Gallium Arsenide Heterojuncti

文件：261.32 Kbytes 页数：12 Pages

RFMD

威讯联合

N-channel P-channel 3-phase motor drive

N-channel + P-channel 3-phase motor drive

文件：38.79 Kbytes 页数：2 Pages

SANKEN

三垦

N-channel P-channel 3-phase motor drive

文件：38.79 Kbytes 页数：2 Pages

SANKEN

三垦