首页>QC5CA12.0000F18A33M>规格书详情
QC5CA12.0000F18A33M中文资料QANTEK数据手册PDF规格书
相关芯片规格书
更多- QC5CA12.0000F12B22R
- QC5CA12.0000F12B23M
- QC5CA12.0000F12B23R
- QC5CA12.0000F12B25M
- QC5CA12.0000F12B25R
- QC5CA12.0000F12B32M
- QC5CA12.0000F12B32R
- QC5CA12.0000F12B33M
- QC5CA12.0000F12B33R
- QC5CA12.0000F12B35M
- QC5CA12.0000F12B35R
- QC5CA12.0000F12B52M
- QC5CA12.0000F12B52R
- QC5CA12.0000F12B53M
- QC5CA12.0000F12B53R
- QC5CA12.0000F12B55M
- QC5CA12.0000F12B55R
- QC5CA12.0000F18A22M
QC5CA12.0000F18A33M规格书详情
特性 Features
• All ceramic epoxy sealed SMD package
• Low in height, suitable for thin equipment
• Tight tolerance and stability available
Applications
• High density applications
• Modem, communication and test equipment