首页>QC3CA12.0000F12B25R3>规格书详情
QC3CA12.0000F12B25R3中文资料QANTEK数据手册PDF规格书
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QC3CA12.0000F12B25R3规格书详情
特性 Features
• Ceramic epoxy sealed SMD package
• Low in height, suitable for thin equipment
• Tight tolerance and stability available
Applications
• High density applications
• Modem, communication and test equipment
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
INTEL |
11+ |
BGA |
1 |
询价 | |||
INTEL/英特尔 |
24+ |
BGA |
20000 |
只做正品原装现货 |
询价 | ||
QC |
36118 |
SOT23-5 |
2015 |
专业代理锂电充电管理IC,型号齐全,公司优势产品 |
询价 | ||
TE |
24+ |
con |
35960 |
查现货到京北通宇商城 |
询价 | ||
BUCHANAN |
2023+ |
SMD |
2500 |
安罗世纪电子只做原装正品货 |
询价 | ||
GRAYCHIP |
16+ |
BGA |
985 |
进口原装现货/价格优势! |
询价 | ||
QANTEK |
2022+ |
原厂原包装 |
6800 |
全新原装 支持表配单 中国著名电子元器件独立分销 |
询价 | ||
INTEL/英特尔 |
23+ |
BGA |
89630 |
当天发货全新原装现货 |
询价 | ||
INTEL/英特尔 |
24+ |
BGA |
21574 |
郑重承诺只做原装进口现货 |
询价 | ||
BUCHANAN |
24+ |
原装进口原厂原包接受订货 |
2500 |
原装现货假一罚十 |
询价 |
