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QC2512.0000F08A30AR3中文资料QANTEK数据手册PDF规格书
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QC2512.0000F08A30AR3规格书详情
特性 Features
• Low in height, suitable for thin equipment
• Ceramic package and metal lid assures high
reliability
• Tight tolerance and stability available
Applications
• High density applications
• Modem, communication and test equipment
• PMCIA, wireless applications
• Automotive applications
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
QANTEK |
2022+ |
原厂原包装 |
6800 |
全新原装 支持表配单 中国著名电子元器件独立分销 |
询价 | ||
N/A |
25+ |
NA |
880000 |
明嘉莱只做原装正品现货 |
询价 | ||
FREESCALE |
23+ |
TSSOP-20 |
89630 |
当天发货全新原装现货 |
询价 | ||
INTEL/英特尔 |
24+ |
NA/ |
3264 |
原厂直销,现货供应,账期支持! |
询价 | ||
TE |
2450+ |
SOP |
6540 |
只做原厂原装正品终端客户免费申请样品 |
询价 | ||
FREESCALE |
2403+ |
TSSOP20 |
6489 |
原装现货热卖!十年芯路!坚持! |
询价 | ||
HammondPowerSolutions |
新 |
5 |
全新原装 货期两周 |
询价 | |||
NA |
8560 |
一级代理 原装正品假一罚十价格优势长期供货 |
询价 | ||||
INTEL/英特尔 |
23+ |
BGA |
15000 |
全新原装现货,价格优势 |
询价 | ||
INTEL/英特尔 |
23+ |
BGA |
3000 |
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、 |
询价 |
