首页 >QBPP0130C-Y>规格书列表
| 零件编号 | 下载&订购 | 功能描述 | 制造商&上传企业 | LOGO |
|---|---|---|---|---|
SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Lowreversecurrent Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0402(1005)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-ST | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0402/SOD-923Fstandardpackage,moldedplastic. -Terminals:Goldplat | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:0805(2012)Standardpackage,moldedplastic Terminals:Solderplated,solderableperMIL-STD-750,method202 | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowdrop-downvoltage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction. -Lowstoredcharge. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderabl | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Halogenfree. Mechanicaldata Case:0603(1608)standardpackage,moldedplastic. Terminals:Goldplated,so | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Lowreversecurrent. Mechanicaldata Case:0603(1608)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode IO=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Goldplate | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythinpackage. Lowstoredcharge. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)standardpackage, moldedplastic. Terminals:Goldplated,solderable | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowstoredcharge. -Majoritycarrierconduction. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderabl | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Goldplat | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Goldplat | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SchottkyBarrierDiode Forwardcurrent:1.0A Reversevoltage:20to40V RoHSDevice Features -Foruseinlowvoltage,highfrequencyinverters. -Freewheeling,andpolarityprotectionapplications. MechanicalData -Case:SOD-123,moldedplastic. -Terminals:solderableperMIL-STD-750,method2026. -Polari | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
LowVFSMDSchottkyBarrierDiode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
LowVFSMDSchottkyBarrierDiode IO=100mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Ultrasmallmoldtype. Mechanicaldata -Case:0201/DFN0603package,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -Polarity:Colorbanddenotescathodeend. -Moun | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SmallSignalSchottkyDiodes | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
Surfacemount,silver(Ag)coatedceramicfilter. | CTSCTS Electronic Components 西迪斯西迪斯公司 | CTS | ||
CurrentLimitingDiodes | CentralCentral Semiconductor Corp 美国中央半导体 | Central |
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
23+ |
N/A |
78000 |
一级代理放心采购 |
询价 | |||
23+ |
N/A |
78000 |
一级代理放心采购 |
询价 | |||
INTEL/英特尔 |
23+ |
BGA |
90000 |
全新原包现货 |
询价 | ||
2018+ |
SMD |
5500 |
一级代理原装现货假一罚十 |
询价 | |||
QTB |
20+ |
N/A |
76 |
加我qq或微信，了解更多详细信息,体验一站式购物 |
询价 | ||
RENESAS/瑞萨 |
23+ |
5177 |
深圳现货 |
询价 | |||
Renesas Electronics |
23+ |
sop |
10000 |
现货常备产品原装可到京北通宇商城查价格 |
询价 | ||
Renesas |
2018+ |
26976 |
代理原装现货/特价热卖! |
询价 |
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