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Features: 1. Meets IEEE 802.3 and ANSI X.3.263 standards including 350uH OCL with 8mA bias. 2. Designed for reflow soldering at temperature 230±5°C. 3. Compact footprint for use in the most space restrictive applications. 4. Turns Ratio tolerance: ±5 5. Operating temperature: -40°C to +85°C

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