Generation DIP and Mini-DIP-IPM

Features: • Ultra Compact Transfer Mold Package • Including Drive and Protection ICs (low and high voltage drive ICs) • Low and High Speed Types • All Mitsubishi DIP and Mini-DIP-IPMs have lead-free terminals • From January 2006 onwards, all DIP and Mini-DIP-IPMs will be supplied with complet

文件：195.62 Kbytes 页数：2 Pages

Mitsubishi

三菱电机

Package：35-PowerDIP 模块（1.370"，34.80mm）；包装：散装 类别：分立半导体产品 功率驱动器模块 描述：MOD IPM 600V 5A MINI DIP

Powerex Inc.

TRANSFER-MOLD TYPE INSULATED TYPE

文件：182.95 Kbytes 页数：9 Pages

Mitsubishi

三菱电机

Generation DIP and Mini-DIP-IPM

Features: • Ultra Compact Transfer Mold Package • Including Drive and Protection ICs (low and high voltage drive ICs) • Low and High Speed Types • All Mitsubishi DIP and Mini-DIP-IPMs have lead-free terminals • From January 2006 onwards, all DIP and Mini-DIP-IPMs will be supplied with complet

文件：195.62 Kbytes 页数：2 Pages

Mitsubishi

三菱电机