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PN-1333-ACMB

包装:袋 类别:盒子,外壳,机架 箱 描述:BOX PLAS GRY/CLR 6.3\

BUD

Bud Industries, Inc.

PN-1333-ACMB

包装:盒 类别:盒子,外壳,机架 箱 描述:BOX PLAS GRY/CLR 6.3\

BUD

Bud Industries, Inc.

S1333

LOWCURRENTCONSUMPTIONHIGHRIPPLE-REJECTION

SIISeiko Instruments Inc

精工爱普生精工爱普生株式会社

S-1333

5.5VINPUT,300mAVOLTAGEREGULATOR

ABLICABLIC Inc.

艾普凌科艾普凌科有限公司

S1333NH

Multi-Conductor-DataBus짰ISA/SP-50FOUNDATIONFieldbusorPROFIBUSCable

BELDENBelden Inc.

百通电缆设计科技有限公司

SCH1333

P-ChannelSiliconMOSFETGeneral-PurposeSwitchingDeviceApplications

General-PurposeSwitchingDeviceApplications Features •1.8Vdrive •Halogenfreecompliance •Protectiondiodein

SANYOSanyo

三洋三洋电机株式会社

SCH1333

P-ChannelPowerMOSFET

Features •1.8Vdrive •Halogenfreecompliance •Protectiondiodein

ONSEMION Semiconductor

安森美半导体安森美半导体公司

SCH1333-TL-H

General-PurposeSwitchingDeviceApplications

SANYOSanyo

三洋三洋电机株式会社

SCH1333-TL-H

P-ChannelPowerMOSFET

Features •1.8Vdrive •Halogenfreecompliance •Protectiondiodein

ONSEMION Semiconductor

安森美半导体安森美半导体公司

SMG1333

P-ChannelEnhancementModePowerMos.FET

SECOSSeCoS Halbleitertechnologie GmbH

喜可士喜可士股份有限公司

SP1333

SP13338pF30kVBidirectionalDiscreteTVS

Description TheSP1333back-to-backdiodesarefabricatedina proprietarysiliconavalanchetechnology.Thesediodes provideahighESD(electrostaticdischarge)protection levelforelectronicequipment.TheSP1333TVScansafely absorbrepetitiveESDstrikesabovethemaximumcontact disc

LittelfuseLittelfuse Inc.

力特富斯(Littelfuse)力特公司

SSM1333GU

P-channelEnhancement-modePowerMOSFET

SSC

Silicon Standard Corp.

ST1333

6-ContactMemoryCardIC272-bitEEPROMwithAdvancedSecurityMechanisms

DESCRIPTION ThemembersoftheST1331/1333/1353familyareprincipallydesignedforuseinprepaidPhonecardapplications.Eachisa272-bitEEPROMdevice,withassociatedsecuritylogicandspecialfusestocontrolmemoryaccess.Thememoryisarrangedasamatrixof34x8cells,accessedin

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

ST1333

MemoryMicromodulesGeneralInformationforD1,D2andCPackaging

DESCRIPTION MemoryCardsconsistoftwomainparts:theplasticcard,andtheembeddedMicromodule(which,inturn,carriesthesiliconchip). ■Micromodulesweredevelopedspecificallyfor embeddinginSmartcardsandMemoryCards ■TheMicromoduleprovides: –Supportforthechi

STMICROELECTRONICSSTMicroelectronics

意法半导体意法半导体(ST)集团

T1333

TRIANGULARTYPE

LEDLAMP(TRIANGULARTYPE)

ETC1List of Unclassifed Manufacturers

etc未分类制造商未分类制造商

TA1333A

SAWFilter2600MHz

TAI-SAW

TAI-SAW TECHNOLOGY CO., LTD.

TB1333A

935.1MHz0.125MHzBWSMD3.8x3.8mmSAWIFFilter

TAI-SAW

TAI-SAW TECHNOLOGY CO., LTD.

TSOP1333

PhotoModulesforPCMRemoteControlSystems

TheTSOP13..–seriesareminiaturizedreceiversforinfraredremotecontrolsystems.PINdiodeandpreamplifierareassembledonleadframe,theepoxypackageisdesignedasIRfilter.

VishayVishay Siliconix

威世科技威世科技半导体

TVAN1333

AluminumCapacitors85C,Miniature,AxialLead

FEATURES •Lowleakagecurrent •Longshelflife •IdealforapplicationinTVsets,autoradios,radio-phonecombinations,electronictestingequipment •Materialcategorization:Fordefinitionsofcompliancepleaseseewww.vishay.com/doc?99912

VishayVishay Siliconix

威世科技威世科技半导体

U1333

TOCHANGEWITHOUTNOTICEACCESSORIES

etc2List of Unclassifed Manufacturers

etc未分类制造商etc2未分类制造商

产品属性

  • 产品编号:

    PN-1333-ACMB

  • 制造商:

    Bud Industries

  • 类别:

    盒子,外壳,机架 > 箱

  • 系列:

    PN

  • 包装:

  • 容器类型:

  • 大小 / 尺寸:

    6.300" 长 x 3.150" 宽(160.02mm x 80.01mm)

  • 高度:

    3.350"(85.09mm)

  • 面积 (L x W):

    19.8in²(128cm²)

  • 设计:

    包含盖

  • 材料:

    塑料 - 聚碳酸酯

  • 颜色:

    灰色,透明外盖/门

  • 厚度:

    0.140"(3.56mm)

  • 等级:

    IP68,NEMA 1,2,4,4X,6,6P,12,13,UL-508

  • 材料可燃性等级:

    UL94 HB

  • 描述:

    BOX PLAS GRY/CLR 6.3\

供应商型号品牌批号封装库存备注价格
BUDINDUSTRIESRADIO
89
全新原装 货期两周
询价
Bud Industries
2022+
19
全新原装 货期两周
询价
Bud
22+
NA
80
加我QQ或微信咨询更多详细信息,
询价
BUD INDUSTRIES
2306+
NA
6680
原装正品公司现货,实单来谈
询价
更多PN-1333-ACMB供应商 更新时间2024-9-25 16:06:00