首页>PM8310>规格书详情

PM8310中文资料TEMUX-336 High Density T1/E1 Framer, & Mapper数据手册Microchip规格书

PDF无图
厂商型号

PM8310

参数属性

PM8310 封装/外壳为896-BGA,FCBGA;包装为托盘;类别为集成电路(IC)的电信;产品描述:IC TELECOM INTERFACE

功能描述

成帧器
TEMUX-336 High Density T1/E1 Framer, & Mapper
IC TELECOM INTERFACE

封装外壳

896-BGA,FCBGA

制造商

Microchip Microchip Technology

中文名称

微芯科技 美国微芯科技公司

数据手册

原厂下载下载地址下载地址二

更新时间

2025-9-24 11:30:00

人工找货

PM8310价格和库存,欢迎联系客服免费人工找货

PM8310规格书详情

描述 Description

The PM8310 TEMUX-336 is a high density T1/E1 framer, VT/TU mapper, and M13 multiplexer with integrated SONET/SDH framers for OC- 12/STM-4 and 4xOC-3/STM-1 applications. Feature integration and scalability make the TEMUX-336 ideal for use in ATCA/AMC line cards, voice and media gateways, routers, and multi-service and edge aggregation switches.

The TEMUX-336 device's unique Extended Serial SONET/SDH Interface (ESSI) enables:
• A low pin-count interconnect to additional TEMUX-336 devices for equipment protection applications
• Higher-rate SONET/SDH framers such as the PM5336 ARROW-2488 for channelized OC-48/STM-16 designs
• SONET/SDH cross-connects in transport applications
• Ethernet over SONET/SDH mappers such as the PM4390 ARROW M8xFE
• Additionally, the device's Scalable Bandwidth Interconnect (SBI) bus enables a simple interconnect to Microchip Layer 2 solutions such as the FREEDM (HDLC processor), S/UNI IMA (ATM inverse multiplexer) and AAL1gator (ATM-based CES processor) families.

Benefits
• Complete SONET/SDH front end with T1/E1, DS3/E3 ATCA/AMC space and power constraints
• Integrated SBI bus simplifies interconnection to layer 2 processors
• Meets timing requirements for wireless backhaul, critical for CESbased 336/252 T1/E1s across the SBI using the V4 byte
• Extended Serial SONET/SDH Interface (ESSI) can aggregate up to 4x protection in ACTA/AMC systems
• Supports linear 1+1 protection on the same device or to a companion TEMUX-336 device
• Enables a scalable architecture from T1/E1 up to OC-12/STM-4
• Supports T1/E1 mapping directly into SONET/SDH using VT1.5/TU-11 or VT2/TU-12 or multiplexed in DS3s using M13 or G.747
• Supports advanced test features including programmable pattern generation and detection for up to 64 byte sequences
• Fully integrated, monolithic IC ensures reliability

Applications
• ATCA/AMC-based line cards
• Voice and media gateways
• Wireless base station controllers (BSC) and radio network controllers (RNC)
• Routers and multi-service switches
• Edge aggregation switches
• Multi-service provisioning platforms



特性 Features

8 OC-3/STM-1 or 2 OC-12/STM-4 SONET/SDH framers (working and protection)
336 T1/252 E1 framers
12 M13 multiplexers, including support for G.747 multiplexing
12 DS3/E3 framers
High order path processor for a SONET STS-12 or an SDH STM-4
Tributary path processor for 336 VT1.5/TU-11s or 252 VT2/TU-12s
Byte-synchronous and bit-asynchronous mapper for 336 VT1.5/TU-11s or 252 VT2/TU-12s
Tributary path processor for 12 TU-3s
Mapper for 12 DS3s or 12 E3s (TU-3 and AU-3)
Up to 8 SONET/SDH Network interfaces (working and protection); 2 may operate at OC-12/STM-4 rates
SONET/SDH Transport and Path overhead interfaces
Two 622-Mbit/s Extended Serial SONET/SDH interfaces (ESSIs)
Line side serial interface for up to 12 DS3s or E3s
System-side 77.76 Scalable Bandwidth Interconnect (SBI336) bus for high-density interconnection of up to 336 T1 streams, 252 E1 streams, 12 DS3 streams, 12 E3 streams, or 12 arbitrary rate streams
System-side serial interface for up to 12 DS3s or E3s
Flexible bandwidth interface for up to 12 fractional rate links
32 Mbit/s synchronous TDM interface (based on H-MVIP)
Microprocessor- and IEEE 1149.1-compliant JTAG interface
16-bit microprocessor interface
Supports transparent virtual tributaries (TVT) where VT1.5/TU-11 and VT2/TU-12 payloads are transported intact between the line side and the SBI336 bus with pointer processing and low order path processing; TVT mode is configurable on a pertributary basis
Provides optional jitter attenuation on the T1/E1 transmit and receive paths, and DS3/E3 transmit and receive paths including DS3/E3s demapped from SONET/SDH
896-pin FCBGA (31 x 31 mm)
Supports industrial temperature range (-40 °C to 85 °C)

简介

PM8310属于集成电路(IC)的电信。由制造生产的PM8310电信电信接口集成电路 (IC) 为通信网络接口提供特定功能和控制,例如以太网切换、线路驱动器、ISDN、放大器、通道扩展器、数字锁相环、DTMF、音频发生器和解码器、回声消除、检测器和发生器、DDA、电话线路监控器和主叫号码标识。

技术参数

更多
  • 制造商编号

    :PM8310

  • 生产厂家

    :Microchip

  • Description

    :PM8310: TEMUX-336

供应商 型号 品牌 批号 封装 库存 备注 价格
PMC
22+
BGA
30000
只做原装正品
询价
PMC
24+
BGA
9600
原装现货,优势供应,支持实单!
询价
FREESCALE
23+
BGA
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
询价
PMC
25+
BGA
2850
询价
PMC
23+
NA
3200
原装正品代理渠道价格优势
询价
PMC
2447
BGA
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
询价
PMC
25+
25000
原厂原包 深圳现货 主打品牌 假一赔百 可开票!
询价
PMC
23+
BGA
50000
全新原装正品现货,支持订货
询价
PMC
25+23+
BGA
20827
绝对原装正品全新进口深圳现货
询价
PMC
21+
FCBGA89
7200
只做原装支持终端
询价