包装：散装 类别：标签，标志，护栏，标识 屏障、路障、地面标记、胶带 描述：SIGN 17\

PANDUIT

包装：散装 类别：标签，标志，护栏，标识 屏障、路障、地面标记、胶带 描述：SIGN 17\

PANDUIT

Old Company Name in Catalogs and Other Documents

Overview These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction effic

文件：448.87 Kbytes 页数：51 Pages

RENESAS

瑞萨

True low-power platform (66 μA/MHz, and 0.57 μA for operation with only RTC and LVD) for the general-purpose applications, with 1.6-V to 5.5-V operation, 16- to 512-Kbyte code flash memory, and 41 DMIPS at 32 MHz

1.1 Features Ultra-low power consumption technology  VDD = single power supply voltage of 1.6 to 5.5 V  HALT mode  STOP mode  SNOOZE mode RL78 CPU core  CISC architecture with 3-stage pipeline  Minimum instruction execution time: Can be changed from high speed (0.03125 μs: @ 32 MHz

文件：3.45818 Mbytes 页数：207 Pages

RENESAS

瑞萨

ULTRA FAST SWITCHING DEVICE

文件：173.65 Kbytes 页数：2 Pages

SSDI