PF0603S4

slow blow fuses

PF0603S4

Slow Blow Chip Fuses; • High Inrush Current Withstanding Capability\n• Compatible with Reflow and Wave Solder\n• Excellent Environmental Performance\n• RoHS & REACH Compliant\n• Halogen-Free Material\n• Life Test: MIL-STD-202, Method 108A\n• Humidity Bias: MIL-STD-202, Method 103\n• Moisture Resistance Test: MIL-STD-202, Method 106G\n• Thermal Shock: MIL-STD-202, Method 107G\n• Terminal Strength: AEC-Q200-005 Appendix 2(Note 1mm Min)\n• Vibration: MIL-STD-202, Method 204D\n• Mechanical Shock: MIL-STD-202, Method 213B\n• Solderability: ANSI/J-STD-002\n• Resistance to Solder Heat: MIL-STD-202, Method 210A\n• Resistance to Solvents: MIL-STD-202, Method 215\n• Ceramic and Glass Package;

PF0603S4.5

Slow Blow Chip Fuses; • High Inrush Current Withstanding Capability\n• Compatible with Reflow and Wave Solder\n• Excellent Environmental Performance\n• RoHS & REACH Compliant\n• Halogen-Free Material\n• Life Test: MIL-STD-202, Method 108A\n• Humidity Bias: MIL-STD-202, Method 103\n• Moisture Resistance Test: MIL-STD-202, Method 106G\n• Thermal Shock: MIL-STD-202, Method 107G\n• Terminal Strength: AEC-Q200-005 Appendix 2(Note 1mm Min)\n• Vibration: MIL-STD-202, Method 204D\n• Mechanical Shock: MIL-STD-202, Method 213B\n• Solderability: ANSI/J-STD-002\n• Resistance to Solder Heat: MIL-STD-202, Method 210A\n• Resistance to Solvents: MIL-STD-202, Method 215\n• Ceramic and Glass Package;

PF0603S4.5

slow blow fuses

S0603S4

SlowBlow