PF0603F500中文资料Fast Acting Chip Fuses数据手册Protek Devices规格书

特性 Features

• Fast Acting for Excessive Current
• Compatible with Reflow and Wave Solder
• Excellent Environmental Performance
• RoHS & REACH Compliant
• Halogen-Free Material
• Life Test: MIL-STD-202, Method 108A
• Humidity Bias: MIL-STD-202, Method 103
• Moisture Resistance Test: MIL-STD-202, Method 106G
• Thermal Shock: MIL-STD-202, Method 107G
• Board Flex: AEC-Q200-005, Appendix 2 (Note 1mm Min)
• Vibration: MIL-STD-202, Method 204D
• Mechanical Shock: MIL-STD-202, Method 213B
• Solderability: MIL-STD-202, Method 208H
• Resistance to Solder Heat: MIL-STD-202, Method 210A
• Ceramic and Glass Package

应用 Application

• Telecommunications Equipment - DSL/Cable Modems
• SMART Phones and other Handheld Devices
• Computers - Laptops, Desktops, Servers
• Computer Peripherals - Printers, LCD Panels, Scanners
• Consumer Electronics - DVD Players, MP3/MP4 Player