ExpressLane??PCI Express to PCI Bridge

ExpressLane™ PCI Express to PCI Bridge Features ƒ General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o 161-ball BGA package with fine 0.65 mm pitch (10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration

文件：112.23 Kbytes 页数：2 Pages

PLX

ExpressLane??PCI Express to PCI Bridge

文件：183.32 Kbytes 页数：2 Pages

BOARDCOM

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PCIe Bridges : PEX 8112

The ExpressLane™ PEX 8112 is a high performance bridge designed to the PCI Express-to-PCI Bridge Specification 1.0, that enables designers to migrate legacy PCI bus interfaces to the new advanced serial PCI Express. This 2-port device is equipped with a single lane PCI Express port and a parallel bu

Broadcom

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ExpressLane??PCI Express to PCI Bridge

ExpressLane™ PCI Express to PCI Bridge Features ƒ General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o 161-ball BGA package with fine 0.65 mm pitch (10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration

文件：112.23 Kbytes 页数：2 Pages

PLX

ExpressLane??PCI Express to PCI Bridge

ExpressLane™ PCI Express to PCI Bridge Features ƒ General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o 161-ball BGA package with fine 0.65 mm pitch (10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration

文件：112.23 Kbytes 页数：2 Pages

PLX

ExpressLane??PCI Express to PCI Bridge

ExpressLane™ PCI Express to PCI Bridge Features ƒ General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o 161-ball BGA package with fine 0.65 mm pitch (10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration

文件：112.23 Kbytes 页数：2 Pages

PLX

ExpressLane??PCI Express to PCI Bridge

ExpressLane™ PCI Express to PCI Bridge Features ƒ General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o 161-ball BGA package with fine 0.65 mm pitch (10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration

文件：112.23 Kbytes 页数：2 Pages

PLX

Package：144-BGA；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：集成电路（IC） 专用 描述：IC INTERFACE SPECIALIZED 144BGA

BOARDCOM

博通