首页 >PC703VC>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
TweezercartridgeforMX-PTZ | ETCList of Unclassifed Manufacturers 未分类制造商 | ETC | ||
IECDISTRIBUTIONUNITS | BULGIN BULGIN COMPONENTS PLC | BULGIN | ||
Intel®Pentium®/Celeron®ApolloLakeSoCprocessorQsevenModule Features •OnboardIntel®Pentium®/Celeron®SoCBGAprocessor•OnboardDDR3L1600/1333MHz4GB,upto8GB•2xSATAIII,6xUSB2.0,2xUSB3.0,3xPCIe2.0•DualChannel18/24-bitLVDS+HDMI•SupportseMMC5.0,SDcard(SDIO3.0)•QsevenFormFactorRev.2.1Compliant•StandardTemperat | BCM bcm advanced search | BCM | ||
HIGHREPEATABILITY,TO-5RELAYSDPDT DESCRIPTION TheultraminiatureRF700andRF703relaysare designedtoprovideimprovedRFsignalswitching repeatabilityoverthefrequencyrange.Theserelaysare engineeredforuseinRFattenuator,RFswitchmatrices, ATEandotherapplicationsthatrequiredependable highfrequencysigna | TELEDYNETeledyne Technologies Incorporated 华特力科 | TELEDYNE | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features •LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). •Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. •UltrasmallFlatLeadPackage(UFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features •LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). •Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. •UltrasmallFlatLeadPackage(UFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features •LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). •Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. •UltrasmallFlatLeadPackage(UFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features •LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). •Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. •ExtremelysmallFlatLeadPackage(SFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features •LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). •Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. •ExtremelysmallFlatLeadPackage(SFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforhighSpeedSwitching Features •LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). •Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. •ExtremelysmallFlatLeadPackage(EFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS |
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