非接触式智能卡控制模块

The P-MCS8-2-1 is a economical thin module (< 250µm) allowing: integration of additional security layer, possibility of very thin inlays, additional layer to reduce card cracks, higher card quality (more coverage over chip). It uses the proven lead frame design from the P-MCC8-2-6. With its standard • 9.5mm\n• max. 250µm\n• ISO 7816-1, ISO 7810, ISO 10373-1/-3\n• Tape on Reel\n\n优势:;

Infineon

英飞凌