OSD32MP153C-512M-IAA中文资料System-in-Package Fully Integrated STM32MP1 System the Same Size as the Processor数据手册Octavo规格书

描述 Description

The OSD32MP15x module is the first System in Package based on the STMicroelectronics STM32MP1. Delivering all the power of a full Microprocessor system in a package that feels like a Microcontroller, the OSD32MP15x has a footprint that is the same size as the ST32MP1 itself. The SiP integrates the STM32MP15x Dual Core Arm® Cortex® A7 and an Arm® Cortex® M4, up to 1GB DDR3, STPMIC1 Power Management IC, EEPROM, MEMS Oscillator, and passives into single BGA package.

At only 18mm x 18mm, the OSD32MP15x brings developers a footprint that is up to 64% smaller than an equivalent design with discrete components. Integrated into a BGA with all signals escaped into one layer, this system in package means faster designs and simplified supply chain.